? semiconductor components industries, llc, 2007 october, 2007 - rev. 0 1 publication order number: NUF8010MU/d NUF8010MU low capacitance 8 line emi filter with esd protection in udfn package this device is an 8 line emi filter array for wireless applications. greater than -20 db typical attenuatio n is obtained at frequencies from 800 mhz to 5.0 ghz. the NUF8010MU has a typical cut-off frequency of 215 mhz. this udfn package is specifically designed to enhance emi filtering for low-profile or slim design electronics especially where space and height is a premium. it also offers esd protection-clamping transients from static discharges. esd protection is provided across all capacitors. features ? emi filtering and esd protection ? integration of 40 discrete components ? compliance with iec61000-4-2 (level 4) ? udfn package, 1.2 x 3.5 mm, 0.4 mm pitch ? moisture sensitivity level 1 ? esd ratings: machine model = c human body model = 3b ? this is a pb-free device* benefits ? reduces emi/rfi emissions on a data line ? low profile package; typical height of 0.5 mm ? design-friendly and easy-to-use pin configurations, particularly for portable electronics ? integrated solution offers cost and space savings in udfn package ? reduces parasitic inductances which offer a more ideal low pass filter response ? integrated solution improves system reliability applications ? emi filtering and esd protection for data lines ? keypad interface and protection for portable electronics ? bottom connector interface for mobile handsets ? notebook computers and digital cameras ? lcd display interface in mobile handsets ? camera display interface in mobile handsets *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information NUF8010MUt2g udfn16 (pb-free) 3000 / tape & reel marking diagram http://onsemi.com (top view) 1 cd cd 16 2 cd cd 15 3 cd cd 14 4 cd cd 13 5 cd cd 12 6 cd cd 11 7 cd cd 10 8 cd cd 9 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. http://onsemi.com udfn16 mu suffix case 517af 1 810 m 1 16 810 = specific device code m = date and assembly location = pb-free package
NUF8010MU http://onsemi.com 2 maximum ratings parameter symbol value unit esd discharge iec61000-4-2 contact discharge v pp 8.0 kv operating temperature range t op -40 to 85 c storage temperature range t stg -55 to 150 c maximum lead temperature for soldering purposes (1.8 in from case for 10 seconds) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. electrical characteristics (t j = 25 c unless otherwise noted) parameter symbol test conditions min typ max unit maximum reverse working voltage v rwm 5.0 v breakdown voltage v br i r = 1.0 ma 6.0 7.0 8.0 v leakage current i r v rwm = 3.3 v 100 na resistance r a i r = 20 ma 85 100 115 capacitance (notes 1 and 2) cd 7.0 11 pf cut-off frequency (note 3) f 3db above this frequency, appreciable attenuation occurs 215 mhz 1. measured at 25 c, v r = 2.5 v, f = 1.0 mhz. 2. total line capacitance is 2 times the diode capacitance (cd). 3. 50 source and 50 load termination.
NUF8010MU http://onsemi.com 3 typical performance curves (t a = 25 c unless otherwise specified) figure 1. typical insertion loss characteristic reverse voltage (v) normalized capacitance temperature ( c) resistance ( ) frequency (hz) figure 2. typical analog crosstalk figure 3. typical capacitance vs. reverse biased voltage (normalized capacitance cd at 2.5 v) figure 4. typical resistance over temperature frequency (hz) s21 (db) -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 -70 -60 -50 -40 -30 -20 -10 0 1.e+06 1.e+07 1.e+08 1.e+09 1.e+ s41 (db) 0 0.5 1 1.5 2 012345 1.05 -40 -20 0 20 40 60 80 1.025 1 0.975 0.95
NUF8010MU http://onsemi.com 4 package dimensions udfn16, 3.5x1.2, 0.4p case 517af-01 issue b notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 16x 0.10 b 0.05 a c c k 16x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 16x a a1 (a3) 0.08 c 0.10 c c seating plane side view l 16x 1 8 9 16 dim min nom max millimeters a 0.45 0.50 0.55 a1 0.00 0.03 0.05 a3 0.127 ref b 0.15 0.20 0.25 d 3.50 bsc d2 2.70 2.80 2.90 e 1.20 bsc e2 0.20 0.30 0.40 e 0.40 bsc k 0.20 --- --- l 0.20 0.25 0.30 14x detail a ?? 1.35 16x 0.35 0.32 15x 0.20 2.85 0.40 pitch dimensions: millimeters 0.30 *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1 0.10 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. typical parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including typicals must be validated for each custom er application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800-282-9855 toll free ?usa/canada europe, middle east and africa technical support: ?phone: 421 33 790 2910 japan customer focus center ?phone: 81-3-5773-3850 NUF8010MU/d literature fulfillment : ?literature distribution center for on semiconductor ?p.o. box 5163, denver, colorado 80217 usa ? phone : 303-675-2175 or 800-344-3860 toll free usa/canada ? fax : 303-675-2176 or 800-344-3867 toll free usa/canada ? email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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